DIP
Under Construction
Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket. Common packages can have anywhere from 4 to 64 pins.
Other names: DIL, PDIP, SDIP, SPDIP, CDIP, CERDIP
0.1" Pitch, 0.3" Wide
The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".
| Drawing | Name | # of Pins | Author | License | Tested | Download | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Eagle | gEDA | KiCAD | Protel | ORCAD | ||||||
 |
DIP8 | 8 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
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DIP14 | 14 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
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DIP16 | 16 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
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DIP18 | 18 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
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DIP24 | 24 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
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DIP28 | 28 | gEDA Project | GPL | No | Link | ||||
0.1" Pitch, 0.4" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.4".
| Drawing | Name | # of Pins | Author | License | Tested | Download | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Eagle | gEDA | KiCAD | Protel | ORCAD | ||||||
 |
DIP24 | 24 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
0.1" Pitch, 0.6" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".
| Drawing | Name | # of Pins | Author | License | Tested | Download | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Eagle | gEDA | KiCAD | Protel | ORCAD | ||||||
 |
DIP24 | 24 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
 |
DIP40 | 40 | SparkFun Electronics | CC 3.0 Share-Alike | No | Link | ||||
