DIP

Under Construction

Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket. Common packages can have anywhere from 4 to 64 pins.

Other names: DIL, PDIP, SDIP, SPDIP, CDIP, CERDIP

0.1" Pitch, 0.3" Wide

The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".

Drawing	Name	# of Pins	Author	License	Tested	Download
						Eagle	gEDA	KiCAD	Protel	ORCAD
DIP4	DIP4	4			No
DIP8	DIP8	8			No
DIP16	DIP16	16			No
DIP24	DIP24	24			No
	DIP28	28			No

0.1" Pitch, 0.6" Wide

A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".

Drawing	Name	# of Pins	Author	License	Tested	Download
						Eagle	gEDA	KiCAD	Protel	ORCAD
DIP4	DIP4	4			No
DIP8	DIP8	8			No
DIP16	DIP16	16			No
DIP24	DIP24	24			No
DIP28	DIP28	28			No