Difference between revisions of "DIP"

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{{Under construction}}
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Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket.
 
Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket.
 +
 +
==0.1" Pitch, 0.3" Wide==
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 +
The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".
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{| class="wikitable" style="width: 100%"
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|-
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! rowspan="2" | Drawing
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! rowspan="2" | Name
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! rowspan="2" | Author
 +
! rowspan="2" | License
 +
! rowspan="2" | Tested
 +
! colspan="5" | Download
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|-
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! Eagle
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! gEDA
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! KiCAD
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! Protel
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! ORCAD
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|-
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| [[File:DIP4-0.1-0.3.svg|DIP4]]
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| DIP4
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|
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|
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| No
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|
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|
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|
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|
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|
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|-
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| [[File:DIP8-0.1-0.3.svg|DIP8]]
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| DIP8
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|
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|
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| No
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|
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|
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|
 +
|
 +
|
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|-
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| [[File:DIP16-0.1-0.3.svg|DIP16]]
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| DIP16
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|
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|
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| No
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|
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|
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|
 +
|
 +
|
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|-
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| [[File:DIP24-0.1-0.3.svg|DIP24]]
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| DIP24
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|
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|
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| No
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|
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|
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|
 +
|
 +
|
 +
|-
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| [[File:DIP28-0.1-0.3.svg|DIP28]]
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| DIP28
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|
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|
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| No
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|
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|
 +
|
 +
|
 +
|
 +
|}
 +
 +
==0.1" Pitch, 0.6" Wide==
 +
 +
A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".
 +
 +
{| class="wikitable" style="width: 100%"
 +
|-
 +
! rowspan="2" | Drawing
 +
! rowspan="2" | Name
 +
! rowspan="2" | Author
 +
! rowspan="2" | License
 +
! rowspan="2" | Tested
 +
! colspan="5" | Download
 +
|-
 +
! Eagle
 +
! gEDA
 +
! KiCAD
 +
! Protel
 +
! ORCAD
 +
|-
 +
| [[File:DIP4-0.1-0.6.svg|DIP4]]
 +
| DIP4
 +
|
 +
|
 +
| No
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|-
 +
| [[File:DIP8-0.1-0.6.svg|DIP8]]
 +
| DIP8
 +
|
 +
|
 +
| No
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|-
 +
| [[File:DIP16-0.1-0.6.svg|DIP16]]
 +
| DIP16
 +
|
 +
|
 +
| No
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|-
 +
| [[File:DIP24-0.1-0.6.svg|DIP24]]
 +
| DIP24
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|
 +
|
 +
| No
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|-
 +
| [[File:DIP28-0.1-0.6.svg|DIP28]]
 +
| DIP28
 +
|
 +
|
 +
| No
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|}
  
 
[[Category:PCB Footprints]]
 
[[Category:PCB Footprints]]

Revision as of 12:43, 11 August 2014

Under Construction

Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket.

0.1" Pitch, 0.3" Wide

The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".

Drawing Name Author License Tested Download
Eagle gEDA KiCAD Protel ORCAD
DIP4 DIP4 No
DIP8 DIP8 No
DIP16 DIP16 No
DIP24 DIP24 No
DIP28 DIP28 No

0.1" Pitch, 0.6" Wide

A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".

Drawing Name Author License Tested Download
Eagle gEDA KiCAD Protel ORCAD
DIP4 DIP4 No
DIP8 DIP8 No
DIP16 DIP16 No
DIP24 DIP24 No
DIP28 DIP28 No
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